Quectel unveils Wi-Fi 6 and Bluetooth 5.2 Module

This device features 2 x 2 MIMO connection capability and an M.2 2230 Key-E package and is based on the Realtek RTL8852 chipset. These low-cost modules are compact measuring 22.0mm x 30.0mm x 2.85mm, simplifying integration into space-constrained designed.

With high power consistency, the M.2 2230 Key-E package and an ultra-wide operating temperature range, this module addresses the demands of industrial, consumer and laptop applications. In addition, the module supports BLE Angle of Arrival (AoA) and Angle of Departure (AoD), Bluetooth Low Energy direction-finding technologies introduced in Bluetooth 5.1 to enable precise location tracking.

Supporting both Linux and Android and capable of supporting older Android kernels (9 to 14), the module can be used for both WLAN and Bluetooth connections and support for 2 x 2 MIMO achieves a maximum physical layer data rate of 1201Mbps.

The module is available with an operating temperature range of -20 °C to +70 °C, intended for any consumer grade applications and an optional extended range of -40 °C to + 85 °C which makes it suitable for the industrial grade applications.

The M.2 2230 Key-E form factor can also be an effective way to reduce production costs, increase production efficiency and meet the demands of complex industrial environments. In addition, the module weighs just 2.28g helping to maximise applicable use cases.

Offering support for the 2.4GHz and 5GHZ Wi-Fi bands as well as Bluetooth 5.2, the Quectel FME163R also features a reliable PCIe 1.1 interface which allows the module to deliver high-speed data transmission while achieving low power consumption.

The FME163R range includes options with two or three antennas.