Industrial Sensors | Teledyne MEMS

The Teledyne MEMS wafer-level packaging (WLP) process platform provides an all-in-one customer solution integrating wafer level fabrication, hermetic packaging and through-silicon-via (TSV) architecture. Our established design kit reduces initial development cost, ultimate manufacturing component cost, footprint, thickness and weight, while simultaneously providing improved electrical performance, reliability, and extensibility into 3D IC designs.

Our WLP process platform can be used for a variety of inertial sensors. The WLP is a proven, cost-effective solution for applications requiring high accuracy, low-noise mechanical sensing by devices operating across wide frequency ranges and requiring high vacuum encapsulation.