ST introduces compact 3-axis vibration sensor

The IIS3DWBG1 sensor integrates three axes of sensing within a single digital device, allowing engineers to streamline hardware design and lower bill-of-materials (BoM) requirements. The component is intended for applications where accurate vibration measurement is critical, including monitoring machinery, motors and vehicle systems.

The sensor’s compact size and operating temperature range of -40°C to 125°C enable flexible placement in challenging environments, where positioning can significantly affect measurement accuracy. Its small footprint also supports integration into space-constrained systems such as smart motors and gearboxes, while low power consumption makes it suitable for battery-powered devices.

Designed to detect a broad range of vibration patterns, the IIS3DWBG1 helps identify issues such as wear, misalignment or looseness in mechanical systems. These capabilities are aimed at supporting predictive maintenance and improving equipment reliability.

Beyond general machinery monitoring, the sensor can also detect vibrations generated within power electronics components, including coils, transformers, capacitors and connectors. In automotive applications, this allows manufacturers to extend diagnostic capabilities to areas such as traction inverters in electric vehicles, contributing to more comprehensive remote monitoring and maintenance.

The device offers stable sensitivity across its full temperature range, eliminating the need for calibration once installed. It combines a flat frequency response from direct current to over 6 kHz with low noise density, enabling detection of small vibration signals and earlier identification of potential faults.

Additional integrated features include configurable filters, an embedded FIFO buffer, interrupt capabilities, a temperature sensor and built-in self-test functions. The sensor is also designed to withstand high levels of mechanical shock, supporting reliability in demanding conditions.

Housed in a 2.5 mm by 3 mm LGA package, the IIS3DWBG1 is intended to reduce printed circuit board space requirements and simplify product design. STMicroelectronics confirmed that the sensor is now in production.